COB module, or Chip On Board module, is an electronic component packaging technology in which the bare chip is directly bonded to the printed circuit board (PCB). This technology adheres the chip to the PCB using conductive or non-conductive glue and achieves electrical connection through wire bonding. The advantages of COB module include low thermal resistance and high power efficiency, suitable for applications requiring high brightness output density. In addition, in order to protect the chip from contamination or human damage, glue is usually used to encapsulate the chip and bonding wires to enhance its reliability and long-term stability.
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