Product Overview
A Chip-on-Glass (COG) Display integrates the driver IC directly onto the glass substrate using Anisotropic Conductive Film (ACF) bonding. By eliminating the traditional Printed Circuit Board (PCB), this architecture achieves an ultra-thin profile, reduced component count, and enhanced mechanical reliability for compact electronic assemblies.
Unlike Chip-on-Board (COB) modules, COG technology minimizes overall module thickness to under 3.0mm, making it the preferred choice for space-constrained handheld instruments, smart appliances, and portable equipment requiring stable performance under continuous operation.
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128*128 COG LCD DisplaysStrong Experience of LCDs for Every Industry BL LCD offers the perfect LCD for variety applications for over 15 years, from character LCDs to graphic LCDs, as modules or COG(Chip On Glass) displaysread more -
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160*160 COG LCD DisplaysStrong Experience of LCDs for Every Industry BL LCD offers the perfect LCD for variety applications for over 15 years, from character LCDs to graphic LCDs, as modules or COG(Chip On Glass) displaysread more -
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240*128 COG LCD DisplaysStrong Experience of LCDs for Every Industry BL LCD offers the perfect LCD for variety applications for over 15 years, from character LCDs to graphic LCDs, as modules or COG(Chip On Glass) displaysread more
The structural composition of a standard COG display module includes:
LCD Glass Substrate: STN, FSTN, or VA liquid crystal materials providing high contrast and wide viewing angles.
Driver IC (On-Glass): Directly bonded to ITO paths via ACF, minimizing signal delay and parasitic capacitance.
FPC (Flexible Printed Circuit): Heat-sealed to the glass edge, supporting standard interfaces such as I2C, SPI, and Parallel.
Backlight Unit (BLU): Side-fire or array LED backlight (available in white, amber, or RGB) with light guide plates optimized for uniform luminance.
Bezel / Mounting Structure: Optional metal frames or adhesive gaskets tailored for precise chassis integration.
Ultra-Low Profile: Module thickness reduced down to 2.2mm, enabling flush-mount enclosure designs.
High Interconnection Density: Direct glass bonding supports fine-pitch traces, accommodating higher resolution matrices up to 320x240 dots.
Reliable Thermal Operation: Optimized liquid crystal formulas ensure stable performance across standard and wide temperature environments.
Low Power Consumption: Designed for battery-powered systems, consuming micro-amperes in static display states.
Enhanced Mechanical Durability: Absence of intermediate PCB connectors eliminates common failure points during mechanical shock exposure.
Technical Specifications
|
Parameter |
Standard Specification Range |
|
Display Type |
STN, FSTN, VA (Positive / Negative) |
|
Resolution |
From 122x32 dots up to 320x240 dots (Custom matrices available) |
|
Driver IC |
ST7567, UC1701, NT7538, or equivalent controllers |
|
Interface |
4-wire SPI, I2C, 8-bit / 6800 / 8080 Parallel |
|
Viewing Angle |
6 o'clock or 12 o'clock (O-Film options for wider angles) |
|
Operating Temp. |
-20°C to +70°C (Standard) / -30°C to +80°C (Extended) |
|
Storage Temp. |
-30°C to +80°C |
|
Backlight Type |
Edge-lit LED (White, Blue, Green, Amber) |
Applications
Handheld Instruments
Portable multimeters, diagnostic tools, and field calibration units.
Smart Home & Appliances
White goods control panels, thermostat displays, and smart home gateways.
Metering Devices
Smart electricity meters, gas monitors, and flow measurement indicators.
Medical Equipment
Portable wellness monitors, infusion pump screens, and clinical testing readouts.
Production is executed in Class 1,000 cleanroom facilities equipped with automated manufacturing lines, backed by comprehensive in-house vertical integration spanning original R&D, structural design, volume manufacturing, and global technical support.
ACF Bonding: Precise thermocompression bonders apply controlled temperature, pressure, and dwell time to ensure electrical continuity across fine-pitch ITO pads.
Automatic Optical Inspection (AOI): 100% inline scanning detects micro-scratches, particle contamination, and bridge defects on glass circuits.
Reliability Testing: Sample batches undergo high-temperature operational life, thermal shock cycles, and vibration checks to verify structural integrity.
Traceability: Laser-etched matrix codes on glass substrates link every module to specific production lots and raw material batches.
Customization & OEM/ODM
Standard off-the-shelf modules can be modified to meet exact mechanical and electrical constraints:
Glass Dimensions & FPC Routing
Custom outline sizes, tailored FPC lengths, and pinout configurations to match existing PCB layouts.
Polarizer Options
Transmissive, transflective, or reflective polarizers tuned for direct sunlight readability or dark-room environments.
Software Integration
Custom initialization code adjustments and built-in font ROM programming.
Prototyping Lead Time
Engineering samples dispatched within 2 to 3 weeks following drawing approval.
FAQ
As one of the leading cog displays manufacturers and suppliers in China, we warmly welcome you to buy advanced cog displays made in China here from our factory. If you have any enquiry about cooperation, please feel free to email us.
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