BLD-M0216SD-162SDAR2-1

Bolong LCD introduces the BLD-M0216SD-162SDAR2-1, a rugged COG dot-matrix LCD module designed for applications requiring high contrast, low power consumption, and compact integration. This module utilizes chip-on-glass technology, directly bonding the driver IC to the LCD glass, eliminating the need for a separate PCB and reducing the overall thickness to 2.0 mm. As an LCD panel manufacturer, we complete all key processes in-house, including glass etching, COG bonding, FPC mounting, backlight assembly, and final module testing. This vertical integration ensures consistent product quality, faster lead times, and highly competitive pricing. The BLD-M0216SD-162SDAR2-1 is widely used in medical monitors, fitness equipment control consoles, IoT edge devices, and industrial control panels.

COG technology provides thinner and more reliable construction than traditional COB, with reduced electromagnetic interference and improved thermal performance.
Dot matrix resolution of 128×64 pixels with customization available up to 240×160, supporting both text and graphical user interfaces.
Ultra-low power consumption of less than 1.5 milliamps at 3.3V in normal operation makes it ideal for battery-powered portable instruments.
Wide operating temperature range from -20°C to +70°C, with extended industrial grade option from -30°C to +80°C available for harsh environments.
Multiple interface options include SPI at up to 10MHz, I²C for minimal pin count, and 8-bit parallel 6800 or 8080 for high-speed data transfer.
Backlight colors available in white, blue, yellow-green, red, and amber with LED side or bottom mounting, all with uniform brightness exceeding 100 cd per square meter.
Built-in controller NT7532 or equivalent supports programmable duty cycle, bias ratio, and power control commands, simplifying embedded program development.
RoHS and REACH compliant, manufactured in our ISO9001:2015 certified factory with full material traceability.

As a genuine LCD manufacturer, Bolong LCD follows a rigorous production process for the BLD-M0216SD-162SDAR2-1. The journey begins with high-quality glass substrates sourced from leading suppliers. We then perform photolithography and etching to create precise electrode patterns. The liquid crystal material is vacuum filled and sealed with our proprietary process. COG bonding uses automated precision machines to attach the driver IC directly to the glass with an accuracy of ±5 micrometers. FPC attachment follows with hot bar soldering. Each module then undergoes a 48-hour aging test at 50°C with full display pattern cycling. Final inspection includes pixel defect detection, contrast ratio measurement, and backlight uniformity check. Only modules passing all tests are packaged in anti-static trays.