Non-Standard Inch/Resolution COB Modules

COB (Chip-on-Board) technology mounts the LCD driver IC directly onto a PCB (printed circuit board) using wire bonding, then encapsulates it with epoxy. Unlike COG (Chip-on-Glass) where the IC is bonded to the glass, COB modules offer greater mechanical robustness, easier heat dissipation, and simpler repair or rework. For applications requiring non-standard inch sizes or non-standard resolutions, COB provides exceptional flexibility at competitive costs.As a professional China LCD factory/manufacturer, Bolong LCD designs and produces fully custom COB modules – from pen‑segment numeric displays to high-resolution graphic panels. Our first division manufactures the LCD glass (pen‑segment black & white, TFT, COG dot matrix, OLED), while our second division designs the driver PCB, mounts the ICs, and develops embedded firmware. This vertical integration allows us to deliver complete COB modules tailored to your exact mechanical, electrical, and optical requirements.

1. Complete Mechanical Freedom
Unlike off‑the‑shelf modules, our COB modules start with a blank PCB. We can create:
Any rectangular, square, or bar shape
Irregular cutouts for switches, LEDs, or sensors
Custom mounting hole positions and patterns
Edge connectors or pin headers exactly where you need them
PCB thickness from 0.8mm to 2.0mm
2. Rugged & Serviceable Construction
COB technology encapsulates the driver IC in epoxy, protecting it from moisture, dust, and vibration. The IC is mounted on a PCB, not on the glass, which means:
Easier rework or replacement if needed
Better heat dissipation for high‑duty applications
Higher mechanical strength for industrial environments
3. Cost‑Effective for Custom Resolutions
For resolutions or segment counts that do not exist in standard COG products, COB often provides a lower total cost because the PCB can be designed to accommodate common driver ICs without expensive glass mask modifications. We optimize the trade‑off between glass tooling and PCB design to minimize your NRE.

In‑house glass production We manufacture the LCD glass pen‑segment, dot matrix, TFT, OLED – not just assemble
In‑house PCB design & assembly Our second division designs the driver PCB and performs SMT/through‑hole assembly
Full vertical integration From glass cutting to IC bonding to firmware programming – all under one roof
ISO9001 certified 100% AOI, electrical test, and burn‑in before shipping
Fast custom prototyping Glass tooling + PCB layout + samples in 4‑6 weeks